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Structure Product M o d e l Semiconductor integrated circuit DSC/DVC system power LSI
BD9639MWV
(1) 6ch DC/DC converter CH1 Boost FET embedded CH2 Buck FET embedded CH3 Buck-Boost FET embedded CH4 Buck-Boost FET embedded CH5 Buck FET embedded CH6 Boost FET embedded Low voltage operation 2.5[V] CH1 supply voltage output for internal circuit Start-up ch,Motor Core CMOS Digital CMOS, Memory LED
Functions
(2) (3) (4) (5) (6) (7) (8) (9) (10) (11)
CH1 PWM/PFM selectable CH3,CH4 Boost-Buck auto switching CH6 integrated Boost output shutdown (CH6 Load switch embedded) Soft-start correspondence to each channel Ground short protectionCH2CH6 Error amp phase compensation(CH1CH6) Operating frequency 1.5[MHz] (CH1CH6) Package of mounting on high heat radiation side UQFN056V7070
SYMBOL Rating VBAT Supply voltage -0.37 VBAT23456 SW6 permissible voltage SW6 24.0 VOUT1 permissible current output IVOUT1 1.0 SW1 permissible current output ISW 1.0 SW2 permissible current output ISW2 2.0 VOUT3 permissible current output IVOUT3 1.0 DSW3 permissible current output IDSW3 1.0 USW3 permissible current output IUSW3 1.0 VOUT4 permissible current output IVOUT4 1.0 DSW4 permissible current output IDSW 1.0 USW4 permissible current output IUSW 1.0 SW5 permissible current output ISW5 0.5 SW6 permissible current output ISW6 0.2 Power dissipation Pd 4.83 (*1) Operating temperature range Topt -20+85 Storage temperature range Tstg -55+150 Junction temperature Tjmax +150 (*1) Implemented on Glass epoxy board ROHM standard board74.2x74.2x1.6[mm3] 4 layers Power dissipation depends on the mounted wiring pattern. Operating supply voltage LIMIT ITEM Symbol MIN TYP VBAT 2.5 3.7 VBAT2 2.5 3.7 VBAT3 2.5 3.7 VBAT supply voltage VBAT4 2.5 3.7 VBAT5 2.5 3.7 VBAT6 2.5 3.7 No radiation-proof design
Absolute maximum ratings Ta=25[] ITEM
Unit V V A A A A A A A A A A A W
MAX 5.5 5.5 5.5 5.5 5.5 5.5
Unit V V V V V V
REV. B
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ITEM
Electrical characteristicsUnless otherwise specifiedVBAT=VBAT2,3,4,5,6=3.7[V]VCC=3.7[V]Ta=25[]
Symbol MIN LIMIT TYP 72 MAX 150 Unit A NOTE XSHDN1=H, XSHDN24=L FB1=0.5[V] sum of VBAT terminal, and VOUT1 terminal XSHDN1=H, XSHDN24=H, TEST1=H FB1=0.5[V] sum of VBAT terminal, and VOUT1 terminal all setting terminal=L sum of VBAT terminal, and VOUT1 terminal XSHDN1 V V V A MHz V V s V V ms V ms V ms V ms V V ms XSHDN24,XSHDN3,XSHDN5,XSHDN6 Power supply 3.7[V] XSHDN24,XSHDN3,XSHDN5,XSHDN6 RT=10[k]
Current consumption (PFM)
ICC1
Current consumption (PWM) Shut current consumption H input voltage 1 L input voltage 1 H input voltage 2 L input voltage 2 H Input current 1 Oscillating frequency 1 Reduced-voltage detection voltage Reduced-voltage return voltage CH1 Start-up time 85 Error amp reference voltage PMOS On resistance NMOS On resistance Maximum duty CH2 Error amp reference voltage Soft-start period 85 PMOS On resistance NMOS On resistance CH3 Error amp reference voltage Soft-start period 85 PMOS On resistance DOWN side NMOS On resistance DOWN side PMOS On resistance UP side NMOS On resistance UP side Maximum duty CH4 Error amp reference voltage Soft-start period 85 PMOS On resistance DOWN side NMOS On resistance DOWN side PMOS On resistance UP side NMOS On resistance UP side Maximum duty CH5 Error amp reference voltage Soft-start period 85 PMOS On resistance NMOS On resistance CH6 Error amp reference voltage 1 Error amp reference voltage 2 Soft-start period 85 Load switch On resistance NMOS On resistance Maximum duty
ICC2 ICC3 VIH1 VIL1 VIH3 VIL3 IIH1 FOSC1 VUVLO1 VUVLO2 TSS1 EREF1 RONP1 RONN1 DMAX1 EREF2 TSS2 RONP2 RONN2 EREF3 TSS3 RONPD3 RONND3 RONPU3 RONNU3 DMAX3 EREF4 TSS4 RONPD4 RONND4 RONPU4 RONNU4 DMAX4 EREF5 TSS5 RONP5 RONN5 EREF6 EREF6.1 TSS6 RONP6 RONN6 DMAX6
1.57 VBAT -0.3 2.5 4.63 1.2 1.75 1.95 310 0.388 76.5 0.390 0.43 0.390 0.85 65 0.390 1.28 65 0.390 0.85 0.380 0.380 2.55 83
2.35 0 9.25 1.5 1.95 2.15 620 0.400 0.24 0.14 85.0 0.400 0.85 0.13 0.08 0.400 1.70 0.24 0.25 0.26 0.16 80 0.400 2.55 0.16 0.21 0.24 0.16 80 0.400 1.70 0.26 0.17 0.400 0.400 5.10 0.23 0.47 90
3.53 10 GND +0.3 GND +0.3 18.5 1.8 2.15 2.35 930 0.412 0.38 0.23 93.5 0.410 1.27 0.21 0.14 0.410 2.55 0.39 0.40 0.42 0.27 95 0.410 3.83 0.26 0.33 0.38 0.26 95 0.410 2.55 0.42 0.28 0.420 0.420 7.65 0.37 0.73 97
mA A V
Start-up period 100 730[us](TYP) XSHDN24=L XSHDN24=H Power supply 3.7[V] Power supply 3.7[V] XSHDN24=H
Start-up period 100 1.0[ms]TYP Power supply 3.7[V] Power supply 3.7[V]
Start-up period 100 2.0[ms]TYP Power supply 3.7[V] Power supply 3.7[V] Power supply 3.7[V] Power supply 3.7[V]
Start-up period 100 3.0[ms]TYP Power supply 3.7[V] Power supply 3.7[V] Power supply 3.7[V] Power supply 3.7[V]
Start-up period 100 2.0[ms]TYP Power supply 3.7[V] Power supply 3.7[V] Constant voltage control side Constant current control side Start-up period 100 6.0[ms]( TYP) Power supply 3.7[V] Power supply 3.7[V]
REV. B
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Block diagram Package outline
9639

Terminal No./Terminal name
Terminal description
Terminal No. Name Equivalent circuit Terminal No Name Equivalent circuit
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
SW1 SW1 PGND1 PGND1 TEST1 VBAT XSHDN1 AGND1 XSHDN24 FB5 PGND5 SW5 VBAT5 XSHDN5 FB4 VOUT4 VOUT4 USW4 USW4 PGND4 PGND4 DSW4 DSW4 VBAT4 VBAT4 DPG4 Reserve FB61
CH1 switching terminal CH1 switching terminal CH1 DRIVER GND terminal CH1 DRIVER GND terminal Test terminal Battery input terminal CH1 shutdown terminal Analog GND terminal CH24 shutdown terminal CH5 feed buck terminal CH5 DRIVER GND terminal CH5 switching terminal CH5 DRIVER power supply terminal CH5 shutdown terminal CH4 feed buck terminal CH4 output terminal CH4 output terminal CH4 Boost side switching terminal CH4 Boost side switching terminal CH4 DRIVER GND terminal CH4 DRIVER GND terminal CH4 Buck side switching terminal CH4 Buck side switching terminal CH4 DRIVER power supply terminal CH4 DRIVER power supply terminal CH4 gate connecting terminal Reserve terminal CH6 feed buck terminal Constant current side
O O G G OG V G G OG G G O V OG G O O O O G G O O V V O OG G
29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
FB6 PGND6 SW6 LSO6 VBAT6 XSHDN6 RT AGND2 VCC PGND2 PGND2 SW2 SW2 VBAT2 VBAT2 FB2 TEST2 XSHDN3 VBAT3 DSW3 DPG3 PGND3 USW3 VOUT3 FB3 FB1 VOUT1 VOUT1
CH6 feed buck terminal Constant current side CH6 DRIVER GND terminal CH6 switching terminal CH6 Load switch output terminal CH6 Load switch input terminal CH6 shutdown terminal Triangle wave setting resistor terminal Analog GND terminal Analog power supply terminal CH2 DRIVER GND terminal CH2 DRIVER GND terminal CH2 switching terminal CH2 switching terminal CH2 DRIVER power supply terminal CH2 DRIVER power supply terminal CH2 feed buck terminal Test terminal CH3 shutdown terminal CH3 DRIVER power supply terminal CH3 Buck side switching terminal CH3 gate connecting terminal CH3 DRIVER GND terminal CH3 Boost side switching terminal CH3 output terminal CH3 feed buck terminal CH1 feed buck terminal CH1 output terminal CH1 output terminal
G G O O V OG (*1) G V G G O O V V G OG OG V O O G O O G G O O
The alphabet on a right edge of the above-mentioned terminal explanation is processing of unused. OOPEN GGND OGOPEN or GND VPower supply (VBAT) (*1)10[K]Pull-down
REV. B
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Instruction for use 1Board patterning VBAT,VBAT2,VBAT3,VBAT4,VBAT5,VBAT6 are must be connected to power supply on the board. VCC must be connected to VOUT1 output on the board. ALL PGND and AGND must be connected to GND on the board. ALL power supply line and GND terminals must be wired with wide/short pattern in order to achieve substantially low impedance. 2. Peripheral circuitry Use low ESR ceramic capacitor for bypass condenser between power supply and GND terminal and place capacitor right next to the IC pins. Place external components such as L and C by IC with wide/short pattern. Draw output voltage from each end of capacitor. Causing short circuit at CH1 output will overload the external diode and may breakdown the component. Prepare physical countermeasures by adding poli-switches and fuses to avoid excess current flow. 3Start-up Keep light load condition by starting up the device. Make it to PWM mode (XSHDN24=LH) after CH1 is started up in PFM mode (XSHDN1=LH), and the VOUT1 output voltage stands up. Moreover, start it about the start of CH3CH5CH6 since the PWM mode (Contain it simultaneously). 4Absolute maximum ratings The quality control of the product has exercised adequate care, however operating above the absolute maximum ratings of supply voltage and/or operational temperature range may cause decay and destroy the IC. If specific mode such that exceeding the Absolute Maximum ratings is expected, please have physical countermeasure such as adding fuses and poli-switches etc. 5Thermal design Take consideration of power dissipation at actual device usage to ensure the satisfactory thermal design margin. (Refer page 6) 6Terminal to Terminal short / mis-mounting While mounting IC on the board, check direction and shift of the IC. If inadequately mounted, IC might be breakdown. Additionally short circuit from unwanted contamination at power supply and GND and/or between any terminals also may cause the defect. 7Operating in strong electromagnetic field Please pay attention using device in the strong electromagnetic field. Device may cause malfunction. 8Thermal shut down.(TSD) Main purpose of TSD is to shutting IC down from runaway effect. It is not to compensate or to protect IC itself . Therefore, please do not continuously operate the IC after TSD circuit is activated and/or premise operations such that TSD circuit function to be used. 9Inspection with set board While connecting capacitor to Low impedance pins, please discharge capacitor by one process by another to prevent stressing the IC. While mounting and removing the IC to/from the Board in the inspection process, be sure to turn off the power supply by each action. Moreover equip ground earth in assembling process for ESD protection and handle with care during the test and/or transportation. 10Input terminals This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each element. For example shown in below picture, the resistor or the transistor is connected to the terminal. When the GND voltage potential is greater than the voltage potential at Terminals A or B, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by applying lower voltage than GND (P substrate) to input terminals. Moreover, please apply each input terminal with lower than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage being applied
Resistor
Terminal A Terminal A
Transistor (NPN)
Terminal B C B E
Terminal B C E
B Stray component N P+ N N P P+ N P substrat e GND GND Neighborhood component
P+ N N
P
P+ N P substrat e
Stray component GND
Stray component
GND
Stray component
implified IC structure 11Usage of this product This IC is designed to be used in DSC/DVD application. Upon using our product to equipments or devices other than above mentioned application, please be sure to consult with our sales representative in advance.
REV. B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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